RT9009 1 ds9009-01 april 2011 www.richtek.com pin configurations applications game console cdma/gsm cellular handsets battery-powered equipment laptop, palmtops, notebook computers hand-held instruments mini pci & pci-express cards pcmcia & new cards portable information appliances 2.5a, ultra-low dropout, ultra-fast cmos ldo regulator ordering information general description the RT9009 is a high performance, 2.5a ldo regulator, offering extremely high psrr and ultra-low dropout. ideal for portable rf and wireless applications with demanding performance and space requirements. regulator ground current increases only slightly in dropout, further prolonging the battery life. the RT9009 also works with low-esr ceramic capacitors, reducing the amount of board space necessary for power applications that is critical in hand-held wireless devices. the RT9009 consumes less than 1 a in shutdown mode and has fast turn-on time of less than 400 s. the other features include ultra-low dropout voltage, high output accuracy, current limiting protection, and high ripple rejection ratio. the RT9009 is available in the to-263s-5 package. (top view) to-263s-5 features ultra fast response in line/load transient < 1 a shutdown current low dropout : 520mv at 2a wide operating voltage ranges : 2.5v to 5.5v ttl-logic-controlled shutdown input current limiting protection thermal shutdown protection low-esr ceramic output capacitor required for stability high power supply rejection ratio rohs compliant and 100% lead (pb)-free note : richtek products are : ` rohs compliant and compatible with the current require- ments of ipc/jedec j-std-020. ` suitable for use in snpb or pb-free soldering processes. 4 2 3 5 1 gnd adj vout (tab) en vin RT9009 package type ms5 : to-263s-5 lead plating system p : pb free g : green (halogen free and pb free)
RT9009 2 ds9009-01 april 2011 www.richtek.com typical application circuit function pin description figure 1. adjustable operation note: the value of r2 should be less than 80k to maintain regulation. pin no. pin name pin function 1 vin power supply input. 2 en chip enable (active high). when the en goes to a logic low, the device will be shutdown. 3 vout regulator output. 4 adj output voltage feedback input. if external feedback resistors are applied, the output voltage will be : v out = 1.25 (1+ ) volts 5 gnd ground. 2 1 r r function block diagram out r1 v = 1.25 x (1+ ) volts r2 vin gnd vout RT9009 c out 4.7uf 2.2uf adj en c in v in v out r1 r2 chip enable 1 2 3 4 5 en vin vout adj gnd logic control por/ocp/otp v ref + - driver
RT9009 3 ds9009-01 april 2011 www.richtek.com absolute maximum ratings (note 1) supply input v oltage ------------------------------------------------------------------------------------------------ 6v en input voltage ----------------------------------------------------------------------------------------------------- 6v power dissipation, p d @ t a = 25 c to-263s-5 ------------------------------------------------------------------------------------------------------------- 3.448w package thermal resistance (note 2) to-263s-5, ja ------------------------------------------------------------------------------------------------------- 29 c/w to-263s-5, jc ------------------------------------------------------------------------------------------------------- 7 c/w lead temperature (soldering, 10 sec.) ------------------------------------------------------------------------- 260 c junction temperature ----------------------------------------------------------------------------------------------- 150 c storage temperature range -- ------------------------------------------------------------------------------------- ? 65 c to 150 c esd susceptibility (note 3) hbm -------------------------------------------------------------------------------------------------------------------- 2kv mm ---------------------------------------------------------------------------------------------------------------------- 200v recommended operating conditions (note 4) supply input voltage ------------------------------------------------------------------------------------------------ 2.5v to 5.5 v en input v oltage ----------------------------------------------------------------------------------------------------- 0v to 5.5v junction temperature range -------------------------------------------------------------------------------------- ? 40 c to 125 c ambient temperature range -------------------------------------------------------------------------------------- ? 40 c to 85 c electrical characteristics parameter symbol test conditions min typ max unit input voltage v in 2.5 -- 5.5 v output voltage range (adjustable) v out_ ad j 1.25 -- 4.5 v quiesc ent current i q v en v ih , i out = 0ma -- 380 500 a shutdow n current i stby v en v il ,v in = 3.3v -- 0.1 1 a current limit i lim 2.6 3.2 -- a dropout voltage v drop v out = 2.8v, i out = 2a -- 520 790 mv load regulation v load 10ma < i out < 2a -- 0.4 2 % line regulation v line v in = 2.5v to 5.5v, i out = 5ma -- -- 1 % logic-low voltage v il -- -- 0.6 en threshold logic-high voltage v ih 1.8 -- -- v enable pin current i en enable -- 0.1 1 a power supply rejection rate psrr i out = 300ma, f = 100hz -- 60 -- db thermal shutdown temperature t sd -- 155 -- thermal shutdown hysteresis t sd -- 30 -- c adj reference voltage tolerance v ref 1.225 1.25 1.275 v adj pin current i adj v adj = v ref -- 10 100 na (v in = 3.3v, v en = v in , c in = 2.2 f (ceramic), c out = 4.7 f (ceramic), t a = 25 c unless otherwise specified)
RT9009 4 ds9009-01 april 2011 www.richtek.com note 1. stresses listed as the above ? absolute maximum ratings ? may cause permanent damage to the device. these are for stress ratings. functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. note 2. ja is measured in the natural convection at t a = 25 c on a high effective four layers thermal conductivity test board of jedec 51-7 thermal measurement standard. the case point of jc is on the exposed pad for the package. the copper area as heat sink is 225mm 2 . note 3. devices are esd sensitive. handling precaution is recommended. note 4. the device is not guaranteed to function outside its operating conditions.
RT9009 5 ds9009-01 april 2011 www.richtek.com typical operating characteristics output voltage vs. input voltage 1.60 1.65 1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.5 3 3.5 4 4.5 5 5.5 input voltage (v) output voltage (v) i out = 0a, r1 = 1.13k , r2 = 2.7k output voltage vs. temperature 1.60 1.65 1.70 1.75 1.80 1.85 1.90 1.95 2.00 -50 -25 0 25 50 75 100 125 temperature output voltage (v) v in = 3.3v, i out = 0a, r1 = 1.13k , r2 = 2.7k ( c) reference voltage vs. temperature 1.2000 1.2125 1.2250 1.2375 1.2500 1.2625 1.2750 1.2875 1.3000 -50 -25 0 25 50 75 100 125 temperature reference voltage (v) v in = 3.3v, i out = 0a ( c) enable voltage vs. temperature 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 -50 -25 0 25 50 75 100 125 temperature enable voltage (v) v in = 3.3v, v out = 1.8v, i out = 0a ( c) rising falling quiescent current vs. input voltage 100 150 200 250 300 350 400 450 500 2.533.544.555.5 input voltage (v) quiescent current (ua) v out = 1.8v, i out = 0a quiescent current vs. temperature 100 150 200 250 300 350 400 450 500 -50 -25 0 25 50 75 100 125 temperature quiescent current (ua) v in = 3.3v, v out = 1.8v, i out = 0a ( c)
RT9009 6 ds9009-01 april 2011 www.richtek.com dropout voltage vs. output current 0 100 200 300 400 500 600 700 800 900 0 250 500 750 1000 1250 1500 1750 2000 output current (ma) dropout voltage (mv) t a = 125 c t a = 25 c t a = ? 40 c psrr -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 100 1,000 10,000 100,000 1,000,000 frequency (hz) psrr (db) v in = 3.3v + 0.1v ac , v out = 1.8v, c in = 1 f/x7r, c out = 2.2 f i out = 0a i out = 300ma current limit vs. input voltage 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 2.5 3 3.5 4 4.5 5 5.5 input voltage (v) current limit (a) v out = 1.8v current limit vs. temperature 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 -50 -25 0 25 50 75 100 125 temperature current limit (a) ( c) v in = 3.3v, v out = 1.8v load transient response time (250 s/div) v out (20mv/div) i out (1a/div) v in = 3.3v, v out = 1.8v, i out = 0a to 1a load transient response time (250 s/div) v out (20mv/div) i out (1a/div) v in = 3.3v, v out = 1.8v, i out = 0a to 2.2a
RT9009 7 ds9009-01 april 2011 www.richtek.com power off from vin time (25ms/div) i out (1a/div) v in = 3.3v, v out = 1.8v, i out = 2.2a v in (2v/div) v out (1v/div) power on from vin time (2.5ms/div) i out (1a/div) v in = 3.3v, v out = 1.8v, i out = 2.2a v in (2v/div) v out (1v/div) power off from en time (1ms/div) i out (1a/div) v in = 3.3v, v out = 1.8v, i out = 2.2a v en (2v/div) v out (1v/div) power on from en time (500 s/div) i out (1a/div) v in = 3.3v, v out = 1.8v, i out = 2.2a v en (2v/div) v out (1v/div) line transient response time (500 s/div) v out (20mv/div) v in = 3v to 4v, v out = 1.8v, i out = 1a v in (1v/div) line transient response time (500 s/div) v out (20mv/div) v in = 3v to 4v, v out = 1.8v, i out = 2.2a v in (1v/div)
RT9009 8 ds9009-01 april 2011 www.richtek.com applications information thermal considerations for continuous operation, do not exceed absolute maximum operation junction temperature. the maximum power dissipation depends on the thermal resistance of ic package, pcb layout, the rate of surroundings airflow and temperature difference between junction to ambient. the maximum power dissipation can be calculated by following formula : p d(max) = (t j(max) ? t a ) / ja where t j(max) is the maximum operation junction temperature, t a is the ambient temperature and the ja is the junction to ambient thermal resistance. for recommended operating conditions specification of RT9009, the maximum operating junction temperature is 125 c. the junction to ambient thermal resistance ja is layout dependent. as shown in figure 2, RT9009 to-263s-5 with 15mm x 15mm pcb copper area on the standard jedec 51-7 four layers thermal test board thermal resistance ja is about 29 c/w. the maximum power dissipation at t a = 25 c can be calculated by following formula : p d(max) = (125 c ? 25 c) / (29 c/w) = 3.448w for to-263s-5 packages figure 2. thermal resistance ja vs. copper area of to-263s-5 package the maximum power dissipation depends on operating ambient temperature for fixed t j(max) and thermal resistance ja . for the RT9009, the figure 3 of de-rating curve allows the designer to see the effect of rising ambient temperature on the maximum power dissipation allowed. figure 3. derating curve for RT9009 package thermal resistance vs. copper area 0 10 20 30 40 50 60 70 0 50 100 150 200 250 300 350 400 pcb copper area (mm 2 ) thermal resistance (c/w) single layout pcb four layout pcb to-263s-5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0255075100125 ambient temperature (c) maximum power dissipation (w) to-263s-5 four layers pcb
RT9009 9 ds9009-01 april 2011 www.richtek.com information that is provided by richtek technology corporation is believed to be accurate and reliable. richtek reserves the ri ght to make any change in circuit design, specification or other related things if necessary without notice at any time. no third party intellectual property infringemen t of the applications should be guaranteed by users when integrating richtek products into any application. no legal responsibility for any said applications is assumed b y richtek. richtek technology corporation headquarter 5f, no. 20, taiyuen street, chupei city hsinchu, taiwan, r.o.c. tel: (8863)5526789 fax: (8863)5526611 richtek technology corporation taipei office (marketing) 5f, no. 95, minchiuan road, hsintien city taipei county, taiwan, r.o.c. tel: (8862)86672399 fax: (8862)86672377 email: marketing@richtek.com outline dimension l2 c b2 a b e v u d e l1 b 5-lead to-263s surface mount package dimensions in millimeters dimensions in inches symbol min max min max a 4.064 4.826 0.160 0.190 b 1.143 1.397 0.045 0.055 b 0.660 0.914 0.026 0.036 b2 0.305 0.584 0.012 0.023 c 1.250 1.450 0.049 0.057 d 9.652 10.668 0.380 0.420 e 8.128 9.652 0.320 0.380 e 1.524 1.829 0.060 0.072 l1 13.000 14.300 0.512 0.563 l2 1.090 1.590 0.043 0.063 u 7.600 ref. 0.299 ref. v 5.900 ref. 0.232 ref.
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